Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : November 19, 2019 - November 21, 2019
We employed gel dispersion of metal nanoparticles to provide self-healing function to metal interconnects. Upon the application of voltage on a damaged metal interconnect covered with the gel, dielectrophoretic force produced by the electric field move the metal nanoparticles towards the crack to form a bridge structure in-between, which enables the metal interconnect to regain its conductive property. In previous studies, however, water was used as the dispersion medium of metal nanoparticles; the device required a reservoir to maintain the solvent. In order to eliminate the reservoir, we proposed the usage of self-standing gel for self-healing. In this study, we fabricated a hydrogel with dispersed metal nanoparticles and evaluated its self-healing property. The result confirms that agarose gels with dispersed gold nanoparticles possess the capability of restoring conductivity of a damaged metal interconnect. Here, the diameter of gold nanoparticles was 5 nm, and the gel concentration was 0.1% g/ml.
