The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2001.9
Session ID : 140
Conference information
140 Creep behavior of binary and ternary aluminum alloys
Fumitoshi ISHIKAWAYasuo KOBAYASHIKeisuke ISHIKAWA
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
Creep test was carried out on solid solution aluminum alloys to study the effect of solute atoms on deformation behavior and creep property at high temperatures. Two kinds of aluminum alloys, A5083 and A6061 were tested. We obtained the experiment equation, t_f = λσ^<-m> for the relation between the applied stress and creep life. The exponent, m was constant independent of the temperature. For A6061 alloy, the contraction creep was observed at lower applied stress. The behavior was expected to be due to the interaction of solute atoms, Mg and Si.
Content from these authors
© 2001 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top