The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2003.11
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Sinter-bonding of Silicon-nitride Using Superplastic Ceramic Source Powders as an Insert
Kazuyoshi WASEDAYoshinobu MOTOHASHIShinjiro Koyama
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 385-386

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Abstract
In this study, ceramic source powders of 3Y-TZP and 3Y-TZP/Al_2O_3 composites, which can show superplasticity during and after sintering were used as insert materials for sinter-bonding of a structural ceramic silico-nitride (Si_3N_4). Temperature, bonding stress, bonding time and thickness of the insert were used as variables for the bonding experiments, and observation on the bonded conditions by SEM, measurement of the 4-point bending strength and analysis of residual thermal stress of bonded specimen by FEM were carried out. The sinter-bonding process and its bonding mechanism are discussed based on the SEM micrograph, bending test result and FEM analysis obtained in present experiment.
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© 2003 The Japan Society of Mechanical Engineers
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