Abstract
Recently, a novel adhesive which can be dismantled has been developed. The adhesive, so called "dismantlable adhesive", consists of resin and thermally expansive microcapsule. Since the adhesive expands greatly as the temperature increases, joints bonded with it can be peeled off due to internal stress caused in the adhesive layer. In order to investigate the expansion and dismantlability of the adhesive and the joint, we measured the thermal expansion of the adhesive and observed the interface between the adhesive and adherends. In addition, cleavage between the adhesive and glass adherends at high temperature was observed.
