The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2007.15
Session ID : 216
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216 Influence of heat treatment on intermetallic layer growth for HOT-DIP tin plated material
Keisuke HATAYA, Motofumi OHKI, Tatsuya ISHIBASHI, Wataru SUZUKI
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Keywords: HOT-DIP tin plated material, Heat treatment, Intermetallic compound layer, Growth behavior
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© 2007 The Japan Society of Mechanical Engineers
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