The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2007.15
Session ID : 528
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528 Characteristics about Thermal Insulation of High Temperature Type Vacuum Insulation Panel using Soluble Polyimide
Kuninari ArakiDaigorou KamotoShin-ichi Matsuoka
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
The utilization will be expected from the high-insulated characteristic as a tool of energy saving also in the high temperature insulation field as for the vacuum insulation panel (VIP) in the future. For high temperature, the material composition and process of VIP were reviewed, the SUS foil was adopted as packaging material, and soluble polyimide was developed as the thermo compression bonding material for high temperature VIP under using at 150℃. To lower the glass-transition temperature (Tg) under 200℃, we elaborated the new soluble polyimide using aliphatic diamine copolymer, and controlled Tg about 176℃. By making from trial VIP and evaluations, they were able to be maintain high performance about coefficient of thermal conductivity [λ<0.008(W/mK) at 150℃].
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© 2007 The Japan Society of Mechanical Engineers
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