The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2012.20
Session ID : 323
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323 Evaluating the electromigration resistance of a lead-free solder by utilizing a sharp tip of Cu trace
Kohta HINO, Masumi SAKA
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Keywords: Electromigration, Lead-free Solder
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© 2012 The Japan Society of Mechanical Engineers
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