The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2012.20
Session ID : 722
Conference information
722 Degradation of resins for adhesives in hot-wet condition
Yasushi KURATAChiaki SATOKazutami WAKABAYASHIShingo KONDOTakashi AOKIAkio SUGIURA
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
The use of adhesively bonded joints has been expanding to many application fields such aircrafts, automotive and electronic devices, and the service condition has recently become severe. Hot-wet condition is especially crucial for resins because adhesives are often used in such environment. But little information is available. Therefore, in this case the degradation of resins used for adhesives should be examined thoroughly. In this study, the mechanical properties for example modulus and strength of resins used for adhesives in hot-wet condition were investigated experimentally.
Content from these authors
© 2012 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top