The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2012.20
Session ID : W309
Conference information
W309 Life Prediction for Solder Joint in Semiconductor Structure Including Effects of Manufacturing Process
Hisashi TANIE
Author information
Keywords: Life prediction, Shape prediction, Crack propagation analysis
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (473K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2012 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top