The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2015.23
Session ID : 625
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625 Deformation Behavior of Ceramic Substrate with Thick Cu Layer in Joining Process
Yu HARUBEPPU, Hisashi TANIE, Koji SASAKI, Nobuhiko CHIWATA, Hiroyuki TESHIMA
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Keywords: Ceramic Substrate, Thermal Warpage, FE Analysis, Plastic Deformation
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© 2015 The Japan Society of Mechanical Engineers
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