The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2018.26
Session ID : 721
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Host: The Japan Society of Mechanical Engineers

Name : [in Japanese]

Date : November 16, 2018

Improvement of adhesion strength of Au thin film by high-density electric current
Kurama KIZAWA, Yuhki TOKU, Yang JU
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Keywords: Thin film, High density current, Adhesion strength, Peel test
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