Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : November 01, 2024 - November 03, 2024
Resin materials are widely used in industrial fields as adhesives, coatings, etc. When used as adhesives or coatings, it is necessary to evaluate the bonding strength quantitatively to ensure their reliability. Several test methods to evaluate adhesion have been proposed and used. However, they have some problems in that the evaluation results are affected by experimental conditions, such as the adhesion thickness, the edge geometry of the interface, etc. In this study, the test method to evaluate the bonding strength using a small column resin formed on the surface of the adherend was proposed, and the validity of the bonding strength assessed by this method was discussed after considering the sample size effect. The main conclusions are summarized as follows. (1) The bonding strength decreased as the column diameter increased due to increasing the deformation of the resin column. (2) The proposed test method could provide a valid bonding strength equivalent to the conventional lap shear test when the optimum column diameter was selected to prevent large deformation in the column.
