Development of Patch-Type Minute Strain Sensor Using Embedded EFPI

Abstract

With recent advances in semiconductor technology, integrated circuits (ICs) have become more and more precise. Therefore, even in the low thermal expansion structure of semiconductor manufacturing equipment, the influence of minute thermal deformation cannot be overlooked. In this study, an easy-to-operate patch-type sensor with an EFPI sensor embedded in a CFRP laminate was devised, and the effect of embedding the sensor on sensing performance was experimentally verified. Measurements during manufacturing showed that the gap length variation of the EFPI was very small. On the other hand, the strain measurement results after manufacturing showed that the gap between the optical fiber and capillary during manufacturing was impregnated with resin, causing the gauge length to change. However, if the impregnation is sufficient, it is also clear that sufficient reproducibility is exhibited.