The Proceedings of Manufacturing Systems Division Conference
Online ISSN : 2424-3108
2023
Session ID : 605
Conference information

Machine learning based quality inspection of semiconductor wafer in a manufacturing process
*Taishi InagakiHiroshi YamakawaYasushi UmedaNoritsugu Hamada
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Abstract
[in Japanese]
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© 2023 The Japan Society of Mechanical Engineers
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