2213 Topology optimization of microwave interlayer transmission device on multilayer substrate

Abstract

This paper presents a structural optimization method for microstrip components based on topology optimization method. In the proposed method, microstrips are modeled using transition boundary condition of the finite element method. By controlling surface impedance value of the boundary condition locally, it is possible to represent any metallic pattern configuration of microstrip devices on the given design area. Partial diferential equation filtering and Heaviside function projection are utilized with the combination with h-continuation. An design example of coupler-divider composite device on multilayer printed circuit board is provided to illustrate our design approach.