Abstract
In this paper, the compact thermal modeling by using the Response Surface Methodology (RSM) is proposed. It is known that the compact model ing in the thermal simulation can reduce the calculation cost for a system model. But our original GA-based technique to develop a thermal compact model takes a considerable CPU time, because it includes thermal simulation processes in the optimazation process. To separate the thermal simulation processes from the optimazation process, we employ the RSM for our new compact modeling technique. We applied this technique to develop a simple compact model, and confirm that it can save the CPU time keeping its accuracy to some extent.
