Abstract
This study examined changes in the crystal structure, the surface morphology and the crystal orientation of electrodeposited film that is extracted from the negative electrode using Au pre-coating and the dispersed plating method that adds colloidal silica (SiO2 suspension) as a dispersant to a copper sulfate electrolytic bath. Because of silica dispersion and Au pre-coating, the crystal particles on the film became fine and made uniform, and the number of particles also increased. In addition, the hardness of copper electrodeposited film rose by around 15% because of the dispersion effect of colloidal silica. Furthermore, planes (111), (200) and (311) of X-ray diffraction pattern on the copper electrodeposited film that dispersed colloidal silica almost disappeared, so the preferred orientation changed from plane (111) to (110).
