The Proceedings of the Space Engineering Conference
Online ISSN : 2424-3191
ISSN-L : 0918-9238
2013.22
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E01 Derivation of Heat Conduction Equation for Thermal Deformation of the Plate, and Its Application to Thermal Buckling Problem
Ryohei ISHIDAYuhki FUJITA
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages _E01-1_-_E01-5_

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Abstract
This report deals with a derivation of heat conduction equation for plate bending analysis and an application of the thermal buckling problem of a thin plate. In the plate, temperature distribution of the direction perpendicular to the plate surface is assumed to be linear function. A finite element formulation of a thermal buckling problem of plate is also performed. As an application of our formulation, a thermal buckling problem of the plate subjected to local heating on the plate surface is analyzed. We can obtain buckling temperature from the finite element analysis. Also, under the transient analysis of temperature, we can estimate when the buckling occurs.
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© 2013 The Japan Society of Mechanical Engineers
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