The Proceedings of the Space Engineering Conference
Online ISSN : 2424-3191
ISSN-L : 0918-9238
2014.23
Session ID : B03
Conference information
B03 Derivation of Heat Conduction Equation for Thermal Deformation of Plate, and Its Application to Thermal Buckling Problem
Ryohei ISHIDA
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
This report deals with a derivation of heat conduction equation for plate bending analysis and an application of the thermal buckling problem of a thin plate. In the plate, temperature distribution of the direction perpendicular to the plate surface is assumed to be linear function. A finite element formulation of a thermal buckling problem of plate is also performed. As an application of our formulation, a thermal buckling problem of the plate subjected to local heating on the plate surface is analyzed. We can obtain buckling temperature from the finite element analysis. Also, under the transient analysis of temperature, we can estimate when the buckling occurs.
Content from these authors
© 2014 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top