Abstract
In three phase contact line region with gas dissolution, phenomena which is marangoni flow due to non-uniform distribution of ingredient concentration is now an important technical issue in cleansing and drying process technology of semiconductor manufacturing industries. In this report, we look to micro liquid film flow in meniscus of three phase contact line direction, clarified the velocity change with time. Then absolute value of the velocity is different from wettability of solid surface. And we show that marangoni flow is useful for elimination of 50nm particles which is adherent silicon wafer. In particular, the elimination effect is noticeable trend to hydrop hilic surface.
