Abstract
The dry-ice blasting is used for cleaning the parts of semiconductor producing equipment. The residual level of contamination after the cleaning on the electrode is affected by the blasting pressure and the diameter of DIP (dry-ice pellets) for the dry-ice blasting process. The blasting pressure and the diameter of DIP are varied and the residual contamination is measured by laser-induced fluorescence spectroscopy. The residual level of contamination varies with the blasting conditions.
