The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2012
Session ID : D211
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D211 Cooling Technology using Boiling Heat Transfer for High Powered Electronic Devices
Koichi SuzukiGang ChenKazuhisa Yuki
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
To obtain cooling data for high power electronic devices such as inverter in electric vehicle, subcooled pool boiling has been performed for binary mixtures of ethylene-glycol and water under atmospheric condition. Volume concentration of ethylene-glycol is 30% and 50%. Microbubble emission boiling is observed at above 40K of liquid subcooling and the heat flux increases higher than CHF. The maximum heat flux is 350W/cm^2 at about 200℃. It satisfies the requirements of maximum cooling heat flux of 300W/cm^2 for a power inverter of future electric vehicle. However, the heat flux and heat transfer coefficient are considerably lower than those of water.
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© 2012 The Japan Society of Mechanical Engineers
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