Abstract
3D devices which contain two or more chips stacked vertically and connected by through silicon via (TSV) will be required for high performance computer (HPC) systems. However heat dissipation is a critical issue because 3D devices are difficult to cool lower layer chips. In this paper, cooling behavior of 3D devices mounted on a printed circuit board (PCB) with thermal vias and thick Cu layer is studied. It is confirmed that thermal vias and thick Cu layer are effective to cool lower layer chips in 3D devices.
