Abstract
For energy saving of the servers, we applied the loop-type thermosyphon to CPU cooling. It is necessary to choose the high-performance boiling surfaces to enhance the performance of thermosyphon. Therefore, we have compared the pin-fin and TE-E as high-performance boiling surfaces in condition that they have , been put in real thermosyphon. As a result, the performances of both are equal in the condition that liquid level enough. In addition, they can cool the CPUs in degree of superheat less than half of the flat plate. However, the pin-fin has not worked enough performance in a condition with a little quantity of water.
