Abstract
Recently, the heat flux of electronic devices increases with rapid development of the semiconductor technology. So, a high performance cooling unit for electronic devices is required. Therefore, we have experimentally investigated the cooling performance of the loop type thermosyphon. In this paper, effects of working fluids on heat exchange performance of this loop type thermosyphon were evaluated in the heat flax ranges from 15W/cm^2 to 135W/cm^2. Two HFO refrigerants and one HFC refrigerant were tested for working fluid. The boiling thermal resistances of two refrigerants are nearly the same and less than that of the other refrigerant.
