The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2015
Session ID : A122
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A122 Heat Exchange Performance of Loop Typed Thermosyphon for Electronic Devices
Mizuki HayashidaShingo KasakiKohei TamuraShigeru Koyama
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Abstract
In recent years, the performance of electronic devices has been significantly improved, while the heat generation density from these devices has increased. In this study, a prototype of loop typed thermosyphon, which consists of an evaporator with vertical finned surface and air-cooled condenser, has been investigated experimentally. Refrigerant HFC-134a is used as working fluid. The effects of volume filling rate of the working fluid on the cooling performance was examined. The thermal resistance and heat receiving surface temperature were measured by varying the input heat flux from 15 to 100 W/cm^2. In the case of 40% volume filling rate, the cooling performance was the highest and heat receiving surface temperature of evaporator is around 85 ℃ at the effective heat flux of 80 W/cm^2 (heat generation of 2.0 kW).
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© 2015 The Japan Society of Mechanical Engineers
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