The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2016
Session ID : C123
Conference information

Evaluation of Formation and Evaporation of Microlayer during Boiling in Mini-Channel with MEMS Sensor
Ryosuke HosoyaOsamu Nakabeppu
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract

Formation and evaporation mechanisms of the microlayer beneath a flat bubble of water in the mini-channel have been investigated by measuring the local wall temperature and the steam temperature in bubble with MEMS thermal sensor, T.C. having the diameter of 25μm and a high speed observation. The initial microlayer thickness and evaporation thickness were evaluated from the local wall heat flux by one–dimensional transient heat conduction analysis with the wall temperature data. The dimensionless initial microlayer thickness and evaporation thickness increased with Capillary number corresponding to the ratio of the viscous force and the surface tension.

Content from these authors
© 2016 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top