Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 22, 2016 - October 23, 2016
In this study we used a phenolic resin substrate with a micro-pore size because of its high water permeability. We measured evaporation ratio for three cases (Pore diameters: 5, 25 micro-meter). A droplet is 5 micro-liter generated by a micro pipet. As a result, it became clear that the evaporation speed of the substrate with a pore size of 25 micro-meter was faster than the other cases. This is because the water permeability is low. We believe that this advantage of a phenolic resin substrate extend the range of application of the pool boiling for IC chip cooling.
