Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 20, 2018 - October 21, 2018
In recent years, the heat flux of electronics has been increased due to the miniaturization of electric devices. Accurate thermal management is required to protect electronics from performance degradation and life span reduction. Thermal contact resistance is one of the important parameters for accurate thermal design. Numerical analysis is attractive method to predict thermal contact resistance. However, estimation of thermal contact resistance is difficult because it is dependent on several parameters. In this study, thermal contact resistance was estimated by numerical analysis. As a result, max height roughness has possibility to predict thermal contact resistance. However, further experiments and numerical analysis are necessary in our future works.
