Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 20, 2018 - October 21, 2018
The effects of molding pressure on thermal diffusivity and thermal conductivity of sand mold have been studied. In this work, resin bonded sand molds were formed with three kinds of sand (Espearl, Flattery silica sand, Silica sand) under conditions of molding pressure 0.2～0.4 MPa. Thermal diffusivity and thermal conductivity of these sand molds were estimated by using an inverse solution for one-dimensional unsteady heat conduction. As a result, thermal diffusivity and thermal conductivity of sand mold formed with Espearl were increasing with increasing of molding pressure. Thermal diffusivity and thermal conductivity of sand mold formed under condition of 0.4 MPa were 28 % and 14 % higher than that of 0.2 MPa respectively. On the other hand, thermal properties of sand molds formed with natural sand were decreasing with increasing of molding pressure.
