Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 20, 2018 - October 21, 2018
This paper describes a heat transfer enhancement around heating components such as electrical devices by the pulsating flow. This report especially tries 2-dimensional numerical analysis of pulsating flow around an array of several heating components mounted in the rectangular enclosure. In this report, visualization of flow and temperature field around the array of the component was especially conducted.
It was found that the application of pulsating flow changes the flow pattern between the component and this affects to the temperature distribution around the components.