Effect of Groove Size on Heat Transfer Performance of Two-phase Immersion Cooling with Lotus Copper Jointed onto a Grooved Heat Transfer Surface

Abstract

This paper describes boiling heat transfer performance of a lotus-type porous copper plate attached onto a grooved heat transfer surface in a saturated pool. The boiling heat transfer experiments are conducted under atmospheric conditions using water as cooling liquid. The lotus copper has uni-directional pore structure in a perpendicular direction to the heated surface, and the average pore diameter and the thickness are 0.49 mm and 2.0 mm, respectively. The boiling curves prove that the utilization of larger size of groove leads to the improvement of the critical heat flux. The critical heat flux in the case of the groove width of 1.0 mm reach is 517 W/cm².