Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 20, 2018 - October 21, 2018
The importance of thermal management is increasing along with the high performance of mobile devices. Moreover, higher performance heat transport technology is expected in the future. Therefore, in this research we propose to use a small and thin loop heat pipe for heat dissipation of mobile equipment. Loop heat pipes (LHPs) are two-phase heat transfer devices that use the evaporation and condensation of the working fluid to transfer heat; they use capillary forces in porous wicks to circulate the fluid. The LHP has a one-way transport length of 200 mm, an evaporator size of 20 mm × 20 mm × (thickness) 1 mm, and a heat transport amount of 10 W or more. In addition, a three-dimensional analysis model is built, and the experimental results are compared with the calculated results.
