Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 12, 2019 - October 13, 2019
In this study, we developed a MEMS heat flux sensor to measure surface local heat transfer in flow boiling in a minichannel. The MEMS heat flux sensor has stacked structure of two thin film temperature sensors, and the local heat flux can be analyzed by 1-D transient heat conduction simulation using the measured two temperatures as boundary conditions. The measured heat flux clearly shows thin film evaporation with a high heat flux over 1MW/m2, dry-out of the thin liquid film and rewetting of the dried surface. The developed sensor was confirmed to be a powerful tool to explore the boiling heat transfer mechanisms.
