Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 12, 2019 - October 13, 2019
Due to a miniaturization of electronic devices, an improvement of temperature measurement techniques for miniaturized electrical components is strongly needed in order to insure the operation guaranteed temperature. Several types of thermocouples are widely used for measuring temperature. However, when temperature of the miniature devices is evaluated by thermocouples, temperature of the measurement points may decrease because the thermocouples dissipate heat like a pin fin. Therefore, in order to improve the measurement accuracy of temperature of the miniaturized devices by using thermocouples, an evaluation of heat transfer around thermocouples becomes important. In this report, a heat transfer experiment around thermocouples installed on the surface of the PCBs was conducted while changing the type and the mounting angle of thermocouples. Through the temperature measurement, the decrease of the temperature around the thermocouples was confirmed.
