Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 10, 2020 - October 11, 2020
Pages 0008-
Silicon sheets are utilized for electrical device cooling in terms of electrical insulation, thermal conductivity characteristics, and deformability. To reduce the contact thermal resistance between the silicon sheet and electrical device, a compressed flexible silicon sheet is used. The compressed silicon sheet realizes a higher thermal conductivity than uncompressed. In this paper, a relationship between compressive load and thermal resistance of silicon sheet is investigated. The test method is proposed, and measured. The thermal resistance of compressed silicon sheet is derived by an input heat flow for temperature controller and heat going through silicon sheet.
