Heat Dissipation Performance of a Thermosiphon Using an Aluminum Boiling Surface Fabricated by Laser Ablation Evaluation of Boiling Enhancement by Visualization

Abstract

Thermosyphons can be one solution to dissipate high density heat from heavily loaded semiconductors installed in limited spaces. To improve boiling heat transfer and critical heat flux of thermodyphons, various aluminum boiling surfaces fabricated by laser micro-texturing are tested. The tested surface having grid grooves exhibited much stronger surface wicking force than others having random cavities. The fabricated surfaces show higher heart transfer coefficient in nucleate boiling. This is rationalized by visualization results: LISS surface generates smaller but large number of bubbles.