Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 09, 2021 - October 10, 2021
In this study, we visualized the generation and growth of voids which is induced by the electromigration in 10μm width Al line type interconnections. The temperature distribution near the voids was also measured using two-dimensional thermoreflectance imaging method when current is applied. The growth and recovery (filling) of the voids were observed and the relationship between the void growth and the temperature distribution was evaluated. We found that the temperature increases in the area where group of voids appears and large temperature gradient is formed around the voids, by which the growth of the voids was accelerated.
