Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 09, 2021 - October 10, 2021
In recent years, a semiconductor device with high power density such as SiC (silicon carbide) is expected to be applied to next-generation automotive inverters. A novel cooling technique is strongly needed to protect devices with high heat flux. We already confirmed that applying the pulsating flow could enhance heat transfer around a cylindrical obstruction while decreasing the time-averaged supply flow rate. In this report, the cooling technology of heating elements with high heat flux was explored using heat transfer by pulsating flow and boiling. The heat transfer was found to remove vapor bubbles around the heating element by pressure fluctuation of pulsating flow.
