Optimal thickness of solid-solid phase change material used for temperature leveling of electronic device

Abstract

The processing performance of smart devices such as smartphones is improving, and the power density is increasing. In addition, smart devices cannot use an active thermal management such as water or air cooling. Therefore, a passive thermal management technology attracts attention. Thermal management technology using phase change materials (PCM) is one of the passive thermal management technologies, and level the temperature fluctuation of electronic chip by the latent heat associated with the phase change. This thermal management technology has the advantage that it can be miniaturized and does not require additional power. In this study, we focus on the thermal management technology using solid-solid PCM, which does not change to the liquid phase, and clarify the relationship between the thermophysical properties and the optimum thickness of the PCM.