Heat Transfer Enhancement of Flow Boiling in Mini-Channel with Copper Heated Surface Having Microstructures

Abstract

In recent years, the heat generation density of electronic devices has been rapidly increasing due to the miniaturization and the higher performance. Nucleate boiling heat transfer with a high heat transfer coefficient is an effective solution to this problem. It is also known that nucleate boiling heat transfer can be further improved by applying microstructure to the heat transfer surface. In this study, subcooled flow boiling experiment was conducted by applying microstructures directly to the surface of copper, which is suitable for practical use. A comparison of the heat transfer enhancement of microstructured surfaces with smooth surfaces is reported.