Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 08, 2022 - October 09, 2022
Three dimensional numerical analysis is utilized for thermal design of electronic devices. In this calculation, power consumption of electronic component are needed for input values, and they have an important consequence for prediction accuracy. But, it is often the case that the values are imprecision, because it is not well defined to measure or calculate the values at the moment. We developed an estimation method using temperature measurements and thermal analysis. We obtained a parameter about thermal of electronic components in advance. Next, the temperature of each electronic components was measured. Then, the power consumption can be obtained using them. This estimation method is effective because it does not require special equipment.
