Effect of thermal interference on power consumption estimation using simulation

Abstract

In the thermal design of electronic devices, power consumption of electronic components are important values. However, the useful method to estimate the value has not been reported. In our previous report, we suggested that the power consumption can be accurately estimated from the temperature of each semiconductor device, using a thermal resistance matrix obtained by heating them on a printed circuit board. In this study, to evaluate the usefulness of this method, we investigated the effect of thermal interference by simulating boards with different wiring patterns, number of thermal vias, and distance between elements, under forced cooling and natural cooling conditions.