The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2000.35
Session ID : 404
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404 Moisture Evaluation of Encapsulant Resin of IC Packages by Microwaves
Yang Ju, Satoshi Sanpei, Masumi Saka, Hiroyuki Abe
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Keywords: Microwave, Nondestructive Evaluation, Moisture, IC Package, Encapsulant Resin
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© 2000 The Japan Society of Mechanical Engineers
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