The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2008.43
Session ID : 103
Conference information
103 Deterioration mechanism of signal transmission quality in an optical module caused by packaging-induced stress
Atsushi KITAMURA, Ken Suzuki, Hideo MIURA
Author information
Keywords: Structural Analysis, Strain, Reliability, four-point-bending test, VCSEL, semiconductor laser
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (427K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2008 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top