The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2008.43
Session ID : 143
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143 Mechanical properties of intermetallic compounds formed at the interface between lead-free solder and an electroplated copper thin film
SC JEONG, Ken SUZUKI, Hideo MIURA
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Keywords: Residual Stress, Residual Strain, Nanoindentation, Pb-free Solder, Semiconductor Device
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© 2008 The Japan Society of Mechanical Engineers
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