The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2011.46
Session ID : 115
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115 Microtexture Change in Electroplated Copper Thin Films under Random Loads
Kinji Tamakawa, Naokazu Murata, Ken Suzuki, Hideo Miura
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Keywords: Strain Measurement, Micromechanics, Thin Film, Fatigue, Electroplated copper, Micro texture, Random Load
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© 2011 The Japan Society of Mechanical Engineers
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