The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2012.47
Session ID : 205
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205 Prediction of Thermal Fatigue Life and Life Extension Technique for Pb-free Solder Bumps in Automotive Electronic Products
Shoho ISHIKAWA, Hironori TOHMYOH, Satoshi WATANABE, Tomonori NISHIMURA, Yoshikatsu NAKANO
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Keywords: Pb-free Solder, Finite Element Analysis, Thermal Fatigue Life, Prediction, Extension
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© 2012 The Japan Society of Mechanical Engineers
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