The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2012.47
Session ID : 230
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230 Highly reliable structural design of three-dimensionally stacked semiconductor packages and modules
Kota Nakahira, Ken Suzuki, Hideo Miura
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Keywords: Reliability, Flip chip structure, Residual stress, Local deformation
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© 2012 The Japan Society of Mechanical Engineers
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