The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2016.51
Session ID : 136
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136 Clarification and Control of the Multiple factors for the Long-term Reliability of the Sub-micro-size Copper Thin-film Interconnections
Takeru KATO, Ken SUZUKI, Hideo MIURA
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Keywords: Reliability, Grain boundary, EBSD, Thin-film, Atomic diffusion, Interconnection
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© 2016 The Japan Society of Mechanical Engineers
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